Wafer with design printed outside active region and spaced by design tolerance of reticle blind

ABSTRACT

A printed wafer. A design is printed within a peripheral portion of the wafer. The peripheral portion of the wafer is between an outer boundary of an active portion of the wafer and an outer boundary of the wafer. The design may be a copy of a portion of a pattern that exists on a reticle of an exposure apparatus. The pattern may includes pattern elements such that adjacent pattern elements are separated by a spacing of about a sum of a first design tolerance (based on how accurately a reticle blind can be positioned within the exposure apparatus) and a second design tolerance (based on how sharply an edge of the reticle blind can be focused on the wafer by a lens). The design may visible to a naked eye unaided with no portion of the printed design within the active portion of the wafer.

This application is a divisional application claiming priority to Ser.No. 11/326,968, filed Jan. 6, 2006, which is a divisional application ofSer. No. 10/064,920, filed Aug. 29, 2002, U.S. Pat. No. 7,005,221,issued Feb. 28, 2006.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to a method of printing a wafer and anassociated exposure apparatus.

2. Related Art

In printing a wafer with integrated circuit chips usingphotolithographic processes, a reticle blind of an exposure apparatusblocks exposure light from reaching portions of the wafer so that theportions of the wafer can be selectively printed. If the reticle blindsare incorrectly positioned, however, the wafer will be incorrectlyprinted. Thus, there is a need for a method, exposure apparatus, andprinted wafer that enables a determination of whether the reticle blindhas been correctly positioned within the exposure apparatus.

SUMMARY OF THE INVENTION

In first embodiments, the present invention provides a method ofprinting a wafer, comprising printing a design within a peripheralportion of the wafer, wherein the peripheral portion of the wafer isbetween an outer boundary of the active portion of the wafer and anouter boundary of the wafer.

In second embodiments, the present invention provides an exposureapparatus for printing a wafer, comprising:

a lens;

a reticle that includes a pattern; and

a reticle blind, wherein the reticle blind is adapted to block a firstportion of light that is passed through the exposure apparatus, whereina transparent portion of the reticle is adapted to transmit a remainingportion of the light, wherein the lens is adapted to focus the remainingportion of the light onto the wafer such that an image of a portion ofthe pattern is printed as a design within a peripheral portion of thewafer, wherein the peripheral portion of the wafer is between an outerboundary of the active portion of the wafer and an outer boundary of thewafer, and wherein the printed design is a function of where the reticleblind is positioned relative to the pattern.

In third embodiments, the present invention provides a printed wafer,comprising: a design printed within a peripheral portion of the wafer,wherein the peripheral portion of the wafer is between an outer boundaryof the active portion of the wafer and an outer boundary of the wafer.

The present invention advantageously provides a method, exposureapparatus, and printed wafer that enables a determination of whether areticle blind has been correctly positioned within the exposureapparatus used for printing the wafer.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 depicts a front view of an exposure apparatus over a wafer, inaccordance with embodiments of the present invention.

FIG. 2 depicts a top view of the wafer of FIG. 1, in accordance withembodiments of the present invention.

FIG. 3 depicts a top view of the reticle of FIG. 1, in accordance withembodiments of the present invention.

FIG. 4 depicts a top view of the wafer of FIG. 2 showing a distributionof device fields in an active area of the wafer, in accordance withembodiments of the present invention.

FIG. 5 depicts the wafer of FIG. 4 showing pattern fields in theperipheral portion of the wafer, in accordance with embodiments of thepresent invention.

FIG. 6 depicts the wafer of FIG. 5 showing reticle blinds over thewafer, in accordance with embodiments of the present invention.

FIG. 7 depicts the wafer of FIG. 5 showing printed designs in thepattern fields, in accordance with embodiments of the present invention.

FIG. 8 depicts pattern elements of an exemplary pattern of the reticleof FIG. 3, in accordance with embodiments of the present invention.

FIG. 9 depicts a reticle blind over a portion of the exemplary patternof FIG. 8, in accordance with embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIG. 1 depicts a front view of an exposure apparatus 10 over a wafer 36,in accordance with embodiments of the present invention. The exposureapparatus 10 comprises a light source 12, a reticle 14, a lens 16, and areticle blind(s) 18. The light source 12 is any type of light source(e.g., an ultraviolet light source) that is known the art for printing awafer. The reticle 14 may comprise, inter alia, a sheet of glass coatedwith chrome on a backside 15 of the reticle 14. The lens 16 focuseslight 13 from the light source 12 onto the wafer 36. The wafer 36comprises a device field 33 and a remaining portion 35. The device field33 of the wafer 36 comprises electrical devices such as semiconductordevices (e.g., integrated circuit chips). The remaining portion 35 ofthe wafer 36 includes other device fields as well as peripheral space ina peripheral portion of the wafer 36. A more complete view of the wafer36 may be found FIG. 4 which shows device fields 41-49 and theperipheral portion 38 of the wafer 36. The device field 33 of FIG. 1represents any one of the device fields 41-49 of FIG. 4. Although theperipheral portion 38 of FIG. 4 includes wasted space, this peripheralportion 38 is beneficially used in the present invention, as will beexplained infra. In FIG. 1, the reticle blind 18 represents one or morereticle blinds. As an example, four reticle blinds may be represented byreticle blind 18, wherein the four reticle blinds are (looking down onthe wafer) an upper reticle blind, a lower reticle blind, a left reticleblind, and a right reticle blind, as explained more explicitly infra inconjunction with FIG. 6. Each individual reticle blind 18 is a thinopaque plate (e.g., a metallic plate) that selectively blocks the light13 from being incident on portions of the wafer 36. This selectivelight-blocking functionality of the reticle blind 18 is not explicitlyshown in FIG. 1, inasmuch as only an edge of the reticle blind 18 andthe wafer 36 is shown in FIG. 1. FIG. 6 depicts upper and lower reticleblinds 64 and 65, respectively, over the wafer 36 in a top view and moreclearly demonstrates the aforementioned selective light-blockingfunctionality of the reticle blind 18.

FIG. 2 depicts a top view of the wafer 36 of FIG. 1, in accordance withembodiments of the present invention. FIG. 2 shows that wafer 36comprises an active portion 40 and a peripheral portion 38. Theperipheral portion 38 of the wafer 36 is between the outer boundary 37of the active portion 40 and the outer boundary 39 of the peripheralportion 38. The outer boundary 39 of the peripheral portion 38 is alsothe outer boundary of the wafer 36 itself. Although the outer boundary39 of the wafer 36 is shown in FIG. 2 as having a circular shape, theouter boundary 39 may have any geometrical shape (e.g., an ellipticalshape, a rectangular shape, an octagonal shape, etc.) capable ofcontaining an active portion.

FIG. 3 depicts a top view of the reticle 14 of FIG. 1, in accordancewith embodiments of the present invention. The reticle 14 comprises aninner area 19 (bounded by surface 66) and patterns 81-92. The inner area19 corresponds geometrically to a device field (e.g., any of the devicefields 41-49 shown in FIG. 4) of the wafer 36, so that the inner area 19transmits the light 13 (see FIG. 1) such that the lens 16 (see FIG. 1)focuses the light 13 onto said device field. In FIG. 3, the patterns81-92 are distributed in such a manner as to transmit the light 13(through the lens 16 of FIG. 1) into the peripheral portion 38 (see FIG.2) of the wafer 36. Using the reticle of FIG. 3, the present inventionprints a subset of the patterns 81-92 into the peripheral portion 38 ofthe wafer 36 as part of the process of printing the wafer 36, in orderto determine whether the reticle blind(s) 18 (see FIG. 1) are correctlypositioned within the exposure apparatus 10 used for printing the wafer36.

FIG. 4 depicts a top view of the wafer 36 of FIG. 2 showing adistribution of the device fields 41-49 in the active portion 40 of thewafer 36, in accordance with embodiments of the present invention. Thedevice fields 41-49 each comprise an area in which one or more devices,such as semiconductor devices (e.g., integrated circuit chips) are to beprinted by the exposure apparatus 10 of FIG. 1. Although FIG. 4 showsnine device fields, the wafer 36 generally includes N device fields,wherein N is a positive integer of at least 1.

FIG. 5 depicts the wafer 36 of FIG. 4 showing pattern fields 51-62 inthe peripheral portion 38 of the wafer 36, in accordance withembodiments of the present invention. The pattern fields 51-62 eachcomprise an area in which a corresponding subset of the patterns 81-92on the reticle 14 (see FIG. 3) is to be printed by the exposureapparatus 10 of FIG. 1 as part of the process of printing the wafer 36.For example, the pattern field 51 of FIG. 5 may correspond to thecollection 81-83 of patterns on the reticle 14 of FIG. 3.

FIG. 6 depicts the wafer 36 of FIG. 5 showing upper and lower reticleblinds 64 and 65, respectively, over the wafer 36, in accordance withembodiments of the present invention. Although not shown in FIG. 6 forsake of simplicity, left and right reticle blinds are generally present.The upper and lower reticle blinds 64 and 65 move are permitted to movein (or opposite to) the direction 50, while left and right reticleblinds are permitted to move in (or opposite to) the direction 34.Definitionally, moving “downward” is moving in the direction 50, moving“upward” is moving in the direction opposite to the direction 50, moving“right” is moving in the direction 34, and moving “left” is moving inthe direction that is opposite to the direction 34. The upper and lowerreticle blinds 64 and 65 (as well as left and right reticle blinds ifpresent) may collectively represent the reticle blind 18 in FIG. 1. Thelower reticle blind 65 covers device fields 44-49 and each of the devicefields 41-43 may be individually exposed and printed by the exposureapparatus 10 of FIG. 1, depending on the position of the left and rightreticle blinds. To expose the device field 41, the right reticle blindwould cover the device fields 42 and 43, and the left reticle blindwould be positioned sufficiently far to the left (i.e., in the directionopposite to the direction 34) such that the device field 41 is uncoveredand exposed. To expose the device field 42, the left reticle blind wouldcover the device field 41 and the right reticle blind would cover thedevice field 43 such that the device field 41 is uncovered and exposed.To expose the device field 43, the left reticle blind would cover thedevice fields 41 and 42, and the right reticle blind would be positionedsufficiently far to the right (i.e., in the direction 34) such that thedevice field 43 is uncovered and exposed. The reticle blinds serve toprotect the adjacent device fields from the light 13 (see FIG. 1) whilea device field is being printed by the exposure apparatus 10 of FIG. 1.For example if the device field 42 is being exposed and printed, then:the lower reticle blind 65 covers device fields 44-46 and protects thedevice fields 44-46 from the light 13, the left reticle blind covers thedevice field 41 and protects the device field 41 from the light 13, andthe right reticle blind covers the device field 43 and protects thedevice field 43 from the light 13. Note that in order to selectivelyexpose the device fields 41, 42, . . . , and 49, the wafer is generallymoved so as to expose each device field individually.

As explained supra, while an individual device area is being printed byuse of the light 13 of the exposure apparatus 10 of FIG. 1, thepositioning of the reticle blinds protects the remaining portions of theactive area 40 from being exposed to the light 13. Hence, it isimportant that the reticle blinds be correctly positioned within theexposure apparatus 10. The present invention determines whether thereticle blinds are correctly positioned, by printing the patterns 81-92(or portions thereof) of the reticle 14 of FIG. 3 into the patternfields 51-62 within the peripheral portion 38 of the wafer 36. Forexample, to determine whether the upper reticle blind 64 is correctlypositioned, the upper reticle blind 64 is moved in the directionopposite to the direction 50 so as to partially cover the patterns 81-83of the reticle 14 (see FIG. 3) and thus also partially cover each (i.e.,one at a time) the pattern fields 51-53. Accordingly, the uncoveredportions of patterns 81-83 of the reticle 14 are sequentially printedinto the corresponding portion of each of pattern fields 51, 52, and 53.The portions of the patterns 81-83 that are covered by the upper reticleblind 64 may differ for each of pattern fields 51-53, since each ofpattern fields 51-53 may be independently printed.

Independently printing each of pattern field 51-53 may be accomplished,inter alia, by printing the pattern field (51, 52, or 53) concurrentwith the printing of a neighboring device field. For example, thepattern field 52 and the device field 42 may be concurrently printed, bypositioning the lower reticle blind 65 and the left and right reticleblinds as described supra for exposing and printing the device field 42,and positioning the upper reticle blind 65 as shown in FIG. 6 so as toprint a portion of the patterns 81-83 of the reticle 14 (see FIG. 3)into the pattern field 52. As another example, the reticle blinds couldbe positioned to concurrently print the device field 41, the patternfield 51, and the pattern field 62, so as to print a portion of thepatterns 81-83 of the reticle 14 (see FIG. 3) into the pattern field 51,and so as to print a portion of the patterns 90-92 of the reticle 14(see FIG. 3) into the pattern field 62. Since the reticle blinds coveronly a portion of the patterns to be printed, only the uncoveredportions of the patterns to be printed are actually printed in each ofthe pattern fields. The user of the apparatus 10 knows where the reticleblinds were positioned (or are supposed to have been positioned) andtherefore also knows which portions of the patterns 81-83 should beprinted into each of pattern fields 51-53. If correct portions of thepatterns 81-83 are printed into each of corresponding portions ofpattern fields 51-53, then the upper reticle blind 64 is correctlypositioned. If incorrect portions of the patterns 81-83 are printed intoany of the pattern fields 51-53, then the upper reticle blind 64 is notcorrectly positioned. Thus, the portions of the patterns 81-83 that areprinted in each of the pattern fields 51-53 serve as a measuring devicefor determining whether the upper reticle blind 64 is correctlypositioned. Similarly, a positioning of the lower reticle blind 65, soas to cover only a portion of the pattern fields 57-59, would facilitatea determination of whether the lower reticle blind 65 is correctlypositioned within the exposure apparatus 10 of FIG. 1. Also, apositioning of the left and right reticle blinds so to cover only aportion of the pattern fields 54-56 and the pattern fields 60-62,respectively, facilitates a determination of whether said left and rightreticle blinds are correctly positioned within the exposure apparatus 10of FIG. 1.

FIG. 7 depicts the wafer 36 of FIG. 5 showing printed designs 21-32 inthe corresponding pattern fields 51-62, in accordance with embodimentsof the present invention. The printed designs 21-23 do not have anyelectrical functionality. Each of the printed designs 21-23 correspondto portions of the patterns 81-83 of the reticle 14 of FIG. 3 whereinsaid portions of the patterns 81-83 are uncovered by the reticle blind64 of FIG. 6. The device field 41 and the design 21 (within the patternfield 51) are each adjacent to a same portion 67 of the outer boundary37 of the active portion 40 of the wafer 36. Similarly, the devicefields 42, 43 and the designs 22, 23 (within the pattern fields 52, 53)are respectively adjacent to same portions of the outer boundary 37 ofthe active portion 40 of the wafer 36. As explained supra in conjunctionwith FIG. 6, the printed designs 21-23 serve as a measuring device fordetermining whether the reticle blind 64 is correctly positioned theexposure apparatus 10 of FIG. 1. The printed designs 21-23 may bevisible to the naked eye of an observing individual. “Visible to thenaked eye” comprises being visible to the naked eye unaided or visibleto the naked eye with use of one or more vision aids such as, interalia, a magnifying device (e.g., a microscope), eyeglasses, contactlenses, etc.

FIG. 8 depicts pattern elements of an exemplary pattern 95 on thereticle 14 of FIG. 3, in accordance with embodiments of the presentinvention. The pattern 95 exemplifies any of the patterns 81-92 on thereticle 14 of FIG. 3. The pattern 95 comprises pattern elements 71-76 asshown. Adjacent pattern elements are separated by a spacing S. Thespacing S is about equal to a design tolerance, wherein the designtolerance is a sum of a first design tolerance and a second designtolerance. The first design tolerance is based on how accurately areticle blind can be positioned within the exposure apparatus 10 ofFIG. 1. The second design tolerance is based on how sharply an edge ofthe reticle blind (e.g., the edge 63 of the reticle blind 64 of FIG. 6)can be focused on the wafer 36 by the lens 16 of the exposure apparatus10 (see FIG. 1). Thus, the printed designs 21-23 in FIG. 7 measure, towithin the design tolerance, where the upper reticle blind 64 ispositioned relative to the patterns 81-83 on the reticle 14 of FIG. 3.

The particular pattern 95 shown in FIG. 8 is merely illustrative. Thescope of the present invention includes any desired pattern with respectto any characteristics such as pattern elements, shape, lines, spacings,curvatures, densities (e.g., shades of gray), etc.

FIG. 9 depicts the upper reticle blind 64 of FIG. 6 over a portion ofthe exemplary pattern 95 of FIG. 8, in accordance with embodiments ofthe present invention. FIG. 9 shows that the edge 63 of the upperreticle blind 64 is positioned at about a midpoint location within thespacing gap between pattern elements 73 and 74 of the exemplary pattern95. Accordingly, pattern elements 71-73 are covered by the reticle blind64, and pattern elements 74-76 are not covered by the upper reticleblind 64. Consequently, if the pattern 95 is aligned over the patternfield 51 in the peripheral portion 38 of the wafer 36 (see FIG. 6) withthe upper reticle blind 64 positioned as shown in FIG. 9, then only thepattern elements 74-76 of the pattern 95 will be printed into thepattern field 51 and the pattern elements 71-73 of the pattern 95 willnot be printed into the pattern field 51. Thus, the design 21 (see FIG.7) encompassing the pattern elements 71-76 in the pattern field 51serves as a measuring device for determining whether the upper reticleblind 64 is correctly positioned within the exposure apparatus 10 ofFIG. 1. Note that a vernier scale could be used in conjunction with amicroscope to facilitate an accurate determination of the position ofthe upper reticle blind 64.

While embodiments of the present invention have been described hereinfor purposes of illustration, many modifications and changes will becomeapparent to those skilled in the art. Accordingly, the appended claimsare intended to encompass all such modifications and changes as fallwithin the true spirit and scope of this invention.

What is claimed is:
 1. A printed wafer, comprising: a design printed within a peripheral portion of the wafer, wherein the peripheral portion of the wafer is between an outer boundary of an active portion of the wafer and an outer boundary of the wafer, wherein the design is a copy of a portion of a pattern that exists on a reticle of an exposure apparatus, wherein the pattern includes a plurality of pattern elements such that adjacent pattern elements are separated by a spacing, wherein the plurality of pattern elements that exists on the reticle consists of a first plurality of pattern elements and a second plurality of pattern elements, wherein the design that is printed within the peripheral portion of the wafer includes the first plurality of pattern elements and does not include the second plurality of pattern elements, wherein the spacing is about equal to a design tolerance, and wherein the design tolerance is a sum of a first design tolerance and a second design tolerance, wherein the first design tolerance is based on how accurately a reticle blind of the exposure apparatus can be positioned within the exposure apparatus, and wherein the second design tolerance is based on how sharply an edge of the reticle blind can be focused on the wafer by a lens of the exposure apparatus.
 2. The printed wafer of claim 1, wherein the active portion of the wafer includes a device field, and wherein the device field and the design are each adjacent to a same portion of the outer boundary of the active portion of the wafer.
 3. The printed wafer of claim 2, wherein the wafer is a semiconductor wafer, and wherein the device field includes at least one integrated circuit chip.
 4. The printed wafer of claim 1, wherein the design is visible to a naked eye unaided.
 5. The printed wafer of claim 1, wherein no portion of the design is within the active portion of the wafer.
 6. The printed wafer of claim 1, wherein the plurality of pattern elements consist of spatially sequenced pattern elements 1, 2, . . . , N, wherein N is an even positive integer of at least 6, wherein the first plurality of pattern elements consists of pattern elements 1, 2, . . . , N/2, and wherein the second plurality of pattern elements consists of pattern elements N/2+1, N/2+2, . . . , N.
 7. The printed wafer of claim 6, wherein pattern elements 1, 3, . . . , N−1 are identical pattern elements, and wherein pattern elements 2, 4, . . . , N are identical pattern elements differing from pattern elements 1, 3, . . . , N−1.
 8. The printed wafer of claim 7, wherein N=6. 